▌Design Structure

Adopts classic gantry structure design, realizing high-speed response and stable operation simultaneously.

▌ Equipment Dimensions (excluding signal tower)

3.4m × 2.65m × 1.8m. Compact layout effectively saves production line floor space.

▌ Electrical & Performance Parameters

Power Supply: 220V / 380V / 50Hz (adaptable to factory environment) | Weight: approx. 6000KG (stable and durable)

Power Consumption: 30KW (high-efficiency energy-saving design to reduce operating costs)、

核心性能参数

• Equipped with high-performance CO2 laser, maximum processing size reaches 2000×1500mm, meeting processing demands of large-size plates.

• The adsorption platform is 1000mm above the ground, designed in line with ergonomics to greatly improve operating comfort.

• Equipment dimension: 3400×2650×1800mm, total weight 6000KG, designed power 30KW with stable and powerful performance.

  
  

Structure Introduction

1.Integrated optical path structure. The entire optical path is mounted on linear motors, enabling easy system commissioning and ensuring consistent beam quality across the full processing range.

2.Built-in dual-fan vacuum suction system realizes full-table material adsorption efficiently.

3.The cabinet base adopts square steel structure with sheet metal enclosure, inside equipped with electric control cabinet and suction fans.

Overall Solution: Stable Adsorption Platform

Stable adsorption platform serves as the core foundation to guarantee cutting precision. With high-power driving force and intelligent cavity control, it balances excellent processing performance and low operation cost perfectly.

Process Flow Introduction

The PDLC zoning etching machine adopts CCD visual automatic positioning system. Equipped with short-wave laser and XY gantry mechanism, it cuts the upper conductive ITO layer of liquid crystal film according to preset patterns, so as to divide the film into independent zones and present diverse pattern effects.

Traditional zoning etching equipment etches raw ITO material first and then coats liquid crystal. Any defects occurring during coating on etched areas will lead to product scrap, resulting in complicated procedures and low yield rate.

This equipment processes pre-shaped liquid crystal films, cutting the upper ITO layer through protective film without damaging the liquid crystal layer, effectively raising the production yield up to 98%.