Fully Automatic Silicon Carbide Picosecond Laser Scribing Machine-Products-Suzhou Hanguang Precision Equipment Co.

Suzhou Hanguang Precision Equipment Co.

Fully Automatic Silicon Carbide Picosecond Laser Scribing Machine

Model:HSYQ355-10B/T

Industry Applications:Silicon Carbide Wafer Cutting

Machine features

Linear high-speed platform (X/Y axis): easy to maintain, long life, high precision, speed;

High-definition CCD industrial camera: (coaxial, high and low magnification, panoramic, lower CCD) positioning speed, high precision;

LED light source: under the flat red and white light source, coaxial light source, high subdivision, brightness uniformity, long service life;

Software: beautiful interface, simple operation, high functional compatibility, easy for newcomers to get started;

Processing type: Silicon Carbide wafer;

Cutting mode: self-developed multi-type unique cutting mode;

A wide range of equipment options, convenient for later equipment upgrades and transformation;

Focus meter: side-axis altimeter, coaxial camera focusing;

Feeding, cutting, dispensing, cleaning, air-drying and rewinding can be carried out at the same time.

Specification

Appearance and size

Serial number	Part name	Quantities	Origin and manufacturer	Note

1	Lasers	1 set	Domestic/Imported

2	XY 2D Platform	1 set	Hanguang customisation

3	CCD vision system	1 set	Made in China

4	Cutting Modules and Light Path Systems	1 set	Hanguang customisation	Independent research and development

5	Specialised software for laser processing	1 set	Hanguang customisation	Independent research and development

6	Loading and unloading mechanism	1 set	Hanguang customisation

7	Industrial controller	1 set	Made in China

8	Monitor (computer)	2 pieces	Made in China

Sample Display

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